Hexaware off Campus Hiring

Hexaware off Campus Hiring





  • Experience:Work experience not required
  • Annual Salary:Max 3 LPA
  • Domains:Other
  • Locations:Chennai, Mumbai, Noida, Pune
  • Open Positions:100


Number of Vacancies: | 100
Target Degree and Branch: |  BSc (CS/IT/Electronics) & BCA
Batch (Graduation Year): | 2022
Salary: | GET : 15K per month stipend for 3 Months, later salary of 3 LPA
Training period Duration: | 3 Months
Designation: | Trainee

Skill Set Required: |
- Good communication skills- Fluent in spoken & written English
- Team player & interpersonal relationship abilities
- High level of energy
- Right Attitude and the ability to thrive in a fast-paced environment
- Should be able to multi – task:  ability to prioritize and manage project related activities
- Possess Openness, reliability, punctuality and flexibility at given tasks

Roles and Responsibilities: |
- As a member of our technology teams, you should be passionate around solving business problems through innovation and engineering practices.
- Gain deep knowledge in programming languages, program design and development procedures.
- Participate as directed in the complete software development life cycle from requirement gathering to deployment of the product
- Design, develop and troubleshoot moderate to complex software applications
- Get associated in development, testing, support of existing/new software applications and solutions
- Undertake any other assignments for which may be allocated to you from time to time
- Cultivate strong working relationships with co-workers

Joining Location: | Mumbai/Pune/Chennai & Noida
Work Mode: Hybrid Model

Tentative Joining Date: | Immediate
Interview Location: | Virtual Mode / Location
Tentative Selection process Start Date: | Immediate
Gender Preference (If any): | No
Academic % Cut-off (10th, 12th, Graduation): | 60% or 6.0 CGPA throughout 10th, 12th and UG/PG

Selection Process: |
- Round 1: | Online Assessment (Aptitude + Domain)
- Round 2: | Communication Assessment
- Round 3: | Technical Interview
- Round 4: | HR Interview

Bond to be Signed: | Yes
Bond Details (if applicable): | Service Agreement for 2 years

 Please note: Students indulging in any form of malpractices during the interview process or displaying inappropriate behaviour such as sharing incorrect profile information or wrong details on resume, not attending interviews after applying to a job, indulging in plagiarism, etc., will immediately be withheld from all career support by Great Learning including immediate removal of access to CareerBoost platform.










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